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Principal Engineer
STATS ChipPAC
Posted
last month

Singapore, Singapore

Onsite

SGD 12K

Senior Level

Full Time

Job Categories

Engineering Manufacturing Research Technology Semiconductor

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Sema Summary

STATS ChipPAC is looking for a Principal Engineer to lead R&D in Silicon Photonics advanced packaging. The role involves collaboration with universities and research institutes to develop next-generation optical interconnects.

About Company

STATS ChipPAC is a leading semiconductor back-end manufacturing and technology services provider, specializing in a wide range of semiconductor applications and advanced packaging technologies.

Core Requirements

M.S. or Ph.D. in Physics, Material Science, or Engineering
Minimum 10 years of experience in the semiconductor industry
5 years in technical or project management roles
Strong background in optics and photonics
Hands-on experience in packaging and measuring fiber-coupled devices

Responsibilities

Lead packaging technology development projects.
Collaborate with cross-functional teams for manufacturable designs.
Work with customers and vendors to bring solutions from concept to production.
Research and create new technologies for emerging applications.
Drive new technology development for product introduction.
Support project management and documentation of technical findings.
Define assembly processes and optimize performance and cost.

Must Have skills

Optics and photonics fundamentalsProject managementCross-functional teamworkCommunication skillsProblem-solving methodologies

Job Keywords

Principal EngineerSilicon PhotonicsPackaging TechnologyR&DSemiconductor

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